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Consortium for Upper-Level Physics Software: Thermal and Statistical Physics Simulations

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The Consortium for Upper Level Physics Software (CUPS) has developed a comprehensive series of Nine Book/Software packages that Wiley will publish in FY `95 and `96. CUPS is an international group of 27 physicists, all with extensive backgrounds in the research, teaching, and development of instructional software. The project is being supported by the National Science Foundation (PHY-9014548), and it has received other support from the IBM Corp., Apple Computer Corp., and George Mason University. The Simulations being developed Astrophysics, Classical Mechanics, Electricity & Magnetism, Modern Physics, Nuclear and Particle Physics, Quantum Mechanics, Solid State, Thermal and Statistical, and Wave and Optics.

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Consortium for Upper-Level Physics Software: Thermal and Statistical Physics Simulations, Jan Tobochnik, Lynna Spornick, Harvey Gould, Robert Ehrlich, William Mac Donald, Maria Dworzecka, Consortium for Upper Level Physics Software

Langue
Année de publication
1995
product-detail.submit-box.info.binding
(souple),
État du livre
Abîmé
Prix
26,39 €

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Titre
Consortium for Upper-Level Physics Software: Thermal and Statistical Physics Simulations
Langue
Anglais
Éditeur
Wiley
Publié
1995
Format
souple
Pages
168
ISBN10
0471548863
ISBN13
9780471548867
Séries
Description
The Consortium for Upper Level Physics Software (CUPS) has developed a comprehensive series of Nine Book/Software packages that Wiley will publish in FY `95 and `96. CUPS is an international group of 27 physicists, all with extensive backgrounds in the research, teaching, and development of instructional software. The project is being supported by the National Science Foundation (PHY-9014548), and it has received other support from the IBM Corp., Apple Computer Corp., and George Mason University. The Simulations being developed Astrophysics, Classical Mechanics, Electricity & Magnetism, Modern Physics, Nuclear and Particle Physics, Quantum Mechanics, Solid State, Thermal and Statistical, and Wave and Optics.