Abstract collection / The 3rd International IEEE Scientific Conference on Physics and Control (PhysCon 2007), September 3rd - 7th 2007 at the University of Potsdam
Jürgen Kurths
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Disponible 16 titres
Thin films of copper oxide and copper grown by atomic layer deposition for applications in metallization systems of microelectronic devices
Thomas WächtlerIndustrial case study on the integration of SysML and AUTOSAR with triple graph grammars
Holger GieseDesign for a testing model of a communication subsystem for a safety-critical control system
Lukáš ŠpendlaDevelopment of biomechatronic devices for measurement of wrenches occuring in animal and human prehension
Omar Eduardo Jiménez LópezProceedings 2012 / HPI Future SOC Lab. [Universität Potsdam ; HPI, Hasso-Plattner-Institut, IT Systems Engineering, Universität Potsdam]. Christoph Meinel ... (Hrsg.)
Christoph MeinelDynamic parameter identification techniques and test structures for microsystems characterization on wafer level
Alexey ShaporinProceedings / 4th International Symposium Technologies for Polymer Electronics - TPE 10
Collectif d'auteursProceedings of the 17th International Student Seminar "Microwave and Optical Applications of Novel Phenomena and Technologies"
Stefan HumblaEfficient algorithms for arbitrary sample rate conversion with application to wave field synthesis
Andreas FranckTagungsband / 12. Ilmenauer TK-Manager-Workshop, Technische Universität Ilmenau, 7. September 2012
Jochen SeitzUsing motion planning and genetic algorithms in movement optimization of industrial robots
Pavol BezákWetting optimized solutions for plasma etch residue removal for application in interconnect systems of integrated circuits
Nicole AhnerA contribution to the development of a special-purpose vehicle for handicapped persons
Mohamed AbdelrahmanPreparation and characterization of carbon nanotube based vertical interconnections for integrated circuits
Holger FiedlerNumerische Simulation des viskoplastischen Verhaltens metallischer Werkstoffe bei endlichen Deformationen
Alexey ShutovThermal and thermal-mechanical simulation for the prediction of fatigue processes in packages for power semiconductor devices
Tilo Poller